Qualcomm’s new 3D Sonic Max fingerprint sensor is bigger than ever


We have known that Qualcomm has been working on in-display fingerprint sensors for a while now, although it was really only earlier this year with the Samsung Galaxy S10 series that the sensor finally went mainstream. Now it seems that Qualcomm has a new sensor that will most likely find its way into 2020’s smartphones.

Dubbed the 3D Sonic Max, this is the successor to last year’s 3D Sonic sensor, which according to Qualcomm will be bigger than ever, or 17 times to be exact. What this means is that the surface area in which users can place their finger on will be larger, which also means that it will be more forgiving in terms of finger placement.

Qualcomm also claims that this will allow for two-finger authentication due to the larger size, along with increased speed and ease of use. We’re not sure which smartphones will be adopting the sensor, but given that Samsung used Qualcomm’s sensor for their 2019 flagships, we wouldn’t be surprised if they were to use this new 3D Sonic Max for 2020’s flagships as well.

That being said, we have to wonder if Qualcomm managed to address some of the issues that presented itself with this year’s sensor, but we’ll just have to wait and see.

Source: Qualcomm

Tyler Lee
A graphic novelist wannabe. Amateur chef. Mechanical keyboard enthusiast. Writer of tech with over a decade of experience. Juggles between using a Mac and Windows PC, switches between iOS and Android, believes in the best of both worlds.

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