UPDATE: MediaTek has since issued a statement regarding the performance test, which you can read here.
A while back, Vivo announced the arrival of its new flagship phone, the Vivo X100. The handset carries the highly-anticipated Dimensity 9300 chipset, MediaTek’s new premium mobile SoC and a major competitor to rival chips such as the Snapdragon 8 Gen 3.
With that in mind, while the chipset holds a lot of promise, it seems that early testing with the X100 has yielded some rather concerning results, especially for fans looking forward to getting their hands on the 9300. It’s reported that recent testing with the X100 (and subsequently the Dimensity 9300) resulted in the X100’s vapor chamber – which is essentially its cooling system – to fold in just around two minutes, with the Dimensity 9300 losing up to 46% of its performance.
— Sahil Karoul (@KaroulSahil) November 23, 2023
This drop in performance is attributed to the 9300’s architecture, which does not include efficiency cores. Instead, the chipset features four high-performance cores, which is one of its biggest differences in comparison with the Snapdragon 8 Gen 3. As a result, even the X100’s cooling solution wasn’t able to keep up with the tremendous draw in power that the 9300 exhibited, a shown in the CPU stress test.
Given all this, it should be interesting to see how the Dimensity 9300 fares in the long run, as more testing and more market-ready products arrive in the coming months.