MediaTek’s continued development and expansion of its Dimensity product line has been full steam ahead over the past couple of years. Just recently, the Taiwanese chip manufacturer announced its new Dimensity 6000 series, alongside the Dimensity 6100+ chipset, which MediaTek says comes with a ton of new upgrades for mobile devices.
According to the company, the new 6100+ chip will be able to give users performance improvements in the way of higher frame rates and more vivid display quality, AI-imaging, as well as sub-6 5G at more affordable prices. CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit states:
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity… The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”
The Dimensity 6100+ comes with two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, support for AI-powered cameras, 10-bit displays, as well as support for up to 108MP Non-ZSL cameras, 2K 30fps video capture, 20% reduced 5G power consumption, new camera features including AI-bokeh, AI-color technology, and 90Hz to 120Hz frame rates for smartphones.
MediaTek adds that the first smartphones with the Dimensity 6100+ chipset will be available in the third quarter of 2023.