Feb 11th, 2020

One of the greatest enemies of electronics is heat, where if a device gets too heat, it will stop functioning properly where it could slow down tremendously, or in more severe cases, result in permanent damage to the device. This is something Xiaomi will be addressing with its upcoming flagship smartphone, the Xiaomi Mi 10.

The company has recently confirmed that one of the features of the Mi 10 is a new and unique three-dimensional cooling system. This is said to help the handset better regulate the temperatures where in addition to hardware cooling, Xiaomi also claims that they will be using AI which can dynamically adjust the cooling in the phone as well.

Exactly how well this cooling system works remains to be seen as we have to try it for ourselves, but at least on paper, it sounds promising. Given that many of us rely heavily on our phones for communication, entertainment, and gaming, ensuring that a phone can keep its cool under heavy loads is of utmost importance.

Other specs of the Mi 10 include the use of Qualcomm’s Snapdragon 865 chipset, LPDDR5 RAM, WiFi 6, UFS 3.0 storage, a triple camera combo on the back, and a slightly curved display. The phone is expected to be officially announced on the 13th of February, and the international variant could also be making an appearance at MWC 2020 towards the end of the month.

Source: GizChina

local_offer    Mi 10   Xiaomi