Qualcomm’s Released Their Dual Core Snapdragon Chipset

• Quentyn Kennemer
• 15 years ago

Qualcomm – the company behind our beloved Snapdragon-based processors that we’re beginning to see in more and more devices today – has announced that they’ve begun sampling their first dual core Snapdragon processors. The new models are the MSM8260 and the MSM8660 and they feature two cores with the ability to run up to 1.2Ghz per core.

They’ve referred to these chipsets as the third generation of Qualcomm chipsets and will be targeted for manufacturers looking to make high-end smartphones. Steve Mollenkopf – the executive vice president of Qualcomm and president of Qualcomm CDMA Technologies – states:

Qualcomm’s first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume.We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets.

Qualcomm also has a third chipset in their third generation of products – the QSD8672 – which has the ability to reach 1.5ghz in each core. That chipset was sampled in the second half of 2009 and we expect to see devices carrying the chipset sometime in  2010. Read ahead for the full press info.

Third-generation Snapdragon Solutions Feature Two Application Processor Cores Running up to 1.2 GHz to Enable Advanced Smartphones

TAIPEI, Taiwan – June 01, 2010 – Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of wireless technologies, products and services, today announced the Company has sampled its first dual-CPU Snapdragon™ chipsets. The Mobile Station Modem™ (MSM™) MSM8260™ and MSM8660™ solutions integrate two of the Company’s enhanced cores running at up to 1.2GHz. Targeted at enabling high-end smartphones, the MSM8x60 solutions are third-generation chipsets from the Company’s expanded Snapdragon platform, which has been powering smartphones, tablets and smartbook devices in markets around the world.

“Qualcomm’s first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume,” said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. “We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets.”

The MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000® 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for high levels of Web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 accelration, 1080p video encode/decode, dedicated low power audio engine, integrated low power GPS, and support for 24-bit WXGA 1280 x 800 resolution displays.

Qualcomm’s Snapdragon family of chipset solutions includes:
• First-generation products: QSD8x50™ with 1GHz enhanced core
• Second-generation products: MSM8x55™ and QSD8x50A™ with 1GHz enhanced core, including multimedia optimizations and 1.3GHz enhanced core, respectively
• Third-generation products: MSM8260, MSM8660 and QSD8672 with dual-CPU architecture featuring enhanced cores running at up to 1.2GHz and 1.5GHz, respectively

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2010 FORTUNE 500 company. For more information, please visit Qualcomm around the Web:

www.qualcomm.com
Blog: www.qualcomm.com/blog
Twitter: www.twitter.com/qualcomm
Facebook: www.facebook.com/qualcomm .

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of ASIC components on a timely and profitable basis, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 27, 2009, and most recent Form 10-Q.