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Google’s Tensor chips haven’t exactly been known for raw power and performance – yes, they’ll get you through the day, but they haven’t been the best SoCs on account of limitations when it comes to graphics-intensive games, battery longevity, and more. And while the Tensor G4 packs big improvements over its predecessors, it still pales in comparison to the likes of competitors such as Qualcomm’s Snapdragon chips, for example.
Over the past few months though, there have been rumors that Google will be developing next year’s Tensor G5 in collaboration with Taiwan Semiconductor Manufacturing Corporation (TSMC), which many users are looking forward to. For context, current and past Tensor chips were developed in collaboration with Samsung, which many were quick to bemoan due to the latter’s somewhat spotty yield with smartphone silicon.
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As such, new rumors indicate that the Tensor G5 – codenamed “Laguna” – will be built using TSMC’s 3nm N3E. for context, this is the same process node that Apple used for the iPhone 16 Pro’s A18 Pro, as well as the M4 chips in some of its laptops. Given how impressive the latter two chips have been so far, it’s probably safe to say that the G5 will easily out-perform previous Tensor chips significantly.
Additionally, there’s even word that the Tensor G6 will be made with TSMC’s N3P, which (if rumors are to be believed) will also be used for Apple’s A19 chip. Should these predictions prove to be true, it might just show that Google really aims to improve its Pixel handsets in all departments, and not just with camera and software optimization.
Source: Android Authority
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