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It is only natural that foldable phones are thicker than your traditional smartphones. If you think about it, they’re kind of like two smartphones sandwiched into one. But if you want a foldable smartphone that isn’t crazy thick, the Honor Magic V3 is actually one of the thinnest foldables out there, and the company is sharing how they made it so thin.
There are several things that Honor has done to make the Magic V3 so thin. For starters, one of them is in the battery technology itself. According to Honor, they have incorporated 10% more silicon in the silicon-carbon battery used in the handset. Ultimately this results in a battery that is physically smaller, while at the same time maintaining its performance.
Secondly, the company has opted to use a titanium vapor chamber for the handset’s cooling system. This titanium substrate measures 0.22mm thin, which Honor claims is the industry’s thinnest. But going so thin isn’t a bad thing. The heat dissipation area has actually increased by 22% while also reducing the weight by 40% and performance by 53%. Basically, this new vapor chamber doesn’t only have a smaller footprint, but it is more efficient.
Last but not least, and this is kind of the heart of all foldable phones, is the hinge technology. We’ve seen how Samsung ran into trouble with the Galaxy Z Fold’s hinge when it first launched. Since then, there have been various improvements made to the design of the hinges in foldable phones. With the Honor Magic V3, Honor uses “Super Steel” which allowed them to slim down the hinge body to 2.84mm. This also gave them more space for structural reinforcement, resulting in a more durable device that is also incredibly thin.
Honor will be presenting the Magic V3 at IFA 2024 which takes place next month. We expect that the company will share plans about the global availability of the handset, so check back with us then for more updates.
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