Aug, 23 2013

Moto X teardown 3

There’s something oddly satisfying about watching the boys at iFixit teardown our most beloved Android devices. Their latest victim? The all new Motorola Moto X. The Moto X doesn’t feature a removable battery cover which means tools are necessary for prying the device open. After iFixit removed the Moto X’s backplate — which was actually adhered to the inside of the device — they were finally able to expose all the inner workings of the device. Underneath the battery, Motorola’s ‘X8 Mobile Computing System” was found hiding and after ripping out the motherboard, they found a variety of microchips:

Moto X motherboard

Notable ICs on the motherboard:

  • Toshiba THGBMAG7A2JBAIR 16 GB eMMC NAND Flash
  • SKhynix H9TKNNNBPDAR RAM (we assume that the Snapdragon S4 Pro is also layered under this IC)
  • Qualcomm PM8921 Power Management IC
  • Texas Instruments TMS320C55
  • NXP 44701
  • Skyworks 77619-12 Multiband Multimode Power Amplifier Module for Quad-Band GSM / EDGE and Penta-Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE
  • Texas Instruments MSP430 F5259 Mixed Signal Microcontroller

While repairing parts in just about any Android device can be a tedious process, the Moto X managed to score a repairability rating of 7 out of 10. Hey, it could be a lot worse. Remember back when the HTC One scored a staggering 1 out of 10?

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